US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Semiconductor device and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,715, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and method for manufacturing the same" was invented by Hyun Su Hwang (Siheung-si, South Korea), Jun Yun Kweon (Cheonan-si, South Korea), Jum Yong Park (Cheonan-si, South Korea), Sol Ji Song (Suwon-si, South Korea), Dong Joon Oh (Suwon-si, South Korea) and Chung Sun Lee (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes an insulating layer on a substrate; a via extending from within the substrate and extending through one face of the substrate and a bottom face of a trench defined in t...