US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Method for producing injection-molded article and electronic device comprising injection-molded article" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,568, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method for producing injection-molded article and electronic device comprising injection-molded article" was invented by Chunghyo Jung (Suwon-si, South Korea), Seonmi Park (Suwon-si, South Korea) and Hyein Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing an injection-molded article, according to various embodiments, comprises: molding an injection-molded article; irradiating, in a primary irradiation operation, a laser on primary irradiation regions spaced from each other, on at least a portion of the surf...