US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Electronic device for detecting defect in semiconductor package and operating method thereof" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,662, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Electronic device for detecting defect in semiconductor package and operating method thereof" was invented by Hyeon Joon Kim (Suwon-si, South Korea), Dongsoo Lee (Suwon-si, South Korea) and Sunghyun Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of operating an electronic device for detecting a defect due to a particle in an equipment generated during a bonding process of a semiconductor chip is disclosed. For example, the method may include obtaining, by the electronic device, profile data including operation informat...