US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Wafer testing apparatus and control method thereof" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,193, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).

"Wafer testing apparatus and control method thereof" was invented by Chunghyun Kim (Suwon-si, South Korea), Cheolkyu Lim (Cheonan-si, South Korea) and Byungwook Jeong (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer testing apparatus includes a probe board disposed above a chamber, a wafer chuck disposed below the probe board and configured to support the wafer, a camera located between the probe board and the wafer chuck and configured to capture images of probe imaging points arranged on a lower surface of the probe board...