US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Substrate processing apparatus and method of manufacturing semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,790, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).

"Substrate processing apparatus and method of manufacturing semiconductor device using the same" was invented by Young Ho Hwang (Hwaseong-si, South Korea), Eun Seok Seo (Gwangmyeong-si, South Korea), Jun O Park (Yongin-si, South Korea), Jae Hong Lim (Pyeongtaek-si, South Korea) and Seok Heo (Busan, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Substrate processing apparatuses and methods of manufacturing a semiconductor device using the same may be provided. A substrate processing apparatus includes a heater in a support plate and comprising...