ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,823, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package structure" was invented by Kyung Don Mun (Suwon-si, South Korea), Geun Woo Kim (Suwon-si, South Korea) and Tae-Young Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure include a silicon substrate, a plurality of dies on the silicon substrate, a mold layer between the plurality of dies, a metal layer covering an upper side of the mold layer and at least a part of upper sides of each of the plurality of dies, and including an opening that exposes a part of the upper side of at ...