US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Semiconductor package including under-bump protection patterns and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,867, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including under-bump protection patterns and method of manufacturing the semiconductor package" was invented by Minjung Kim (Suwon-si, South Korea), Jongbeom Park (Suwon-si, South Korea) and Ji-Hyun Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor package may include providing a semiconductor chip, forming redistribution patterns, which are provided on a top surface of the semiconductor chip and are electrically connected to the semiconductor chip, forming a protectio...