US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,839, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Gun Lee (Suwon-si, South Korea) and Jun Woo Myung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package. The semiconductor package may include a first redistribution structure, a first semiconductor chip including a first surface and a second surface, the first surface being disposed to face the first redistribution structure, a second redistribution structure disposed on the second surface of the first semiconductor chip and includ...