ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,868, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).
"Semiconductor package" was invented by Soohyun Nam (Yongin-si, South Korea) and Younglyong Kim (Anyang-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including an interposer substrate, first to third semiconductor chips on the interposer substrate to face each other, an underfill part between each of the first to third semiconductor chips and the interposer substrate, a first side-fill part extending upward from a lower end of side walls of the first to third semiconductor chips, and a second side-fill part betwee...