US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Semiconductor module including a clip structure" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,822, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor module including a clip structure" was invented by Hyunggyun Noh (Suwon-si, South Korea), Sangwoo Pae (Suwon-si, South Korea) and Jinsoo Bae (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor module comprising a module substrate having a top surface and a bottom surface that are opposite to each other, a plurality of semiconductor packages on the top surface of the module substrate and arranged in a first direction parallel to the top surface of the module substrate, and a clip structure on t...