US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Method of fabricating semiconductor device" (South Korean Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,614, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of fabricating semiconductor device" was invented by Eunjung Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device is provided. The method includes: forming a lower structure including a cell array region and an extension region, the cell array region including a first impurity region, a second impurity region and word lines extending in a first direction, and the extension region including an insulating layer; forming a preliminary bit line structure on the lower structure; formin...