US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Grinding apparatus and method for manufacturing semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,914, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Grinding apparatus and method for manufacturing semiconductor device using the same" was invented by Junghyun Roh (Suwon-si, South Korea), Jongguw Kim (Suwon-si, South Korea), Wangsun Lim (Suwon-si, South Korea), Manhee Han (Suwon-si, South Korea) and Jaeyoung Hong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A grinding apparatus and a method for manufacturing a semiconductor device using the same are provided. A grinding apparatus includes a chuck unit configured to receive a substrate, a grinding unit on a part of the chuck un...