US Patent Issued to SAMSUNG ELECTRONICS on March 24 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,551, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Seunghyun Cho (Suwon-si, South Korea), Joonsik Sohn Lee (Yongin-si, South Korea) and Chulhwan Choo (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor package includes first, second, third and fourth semiconductor chips sequentially stacked on one another. Each of the first, second, third and fourth semiconductor chips includes a first group of bonding pads and a second group of bonding pads...