ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,500, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Kyungdon Mun (Asan-si, South Korea), Donghwa Kwak (Suwon-si, South Korea) and Inho Roh (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a first semiconductor chip mounted on the package substrate and that includes a first semiconductor substrate that includes through electrodes, and a second semiconductor chip disposed on the first semiconductor chip and that includes a second semiconductor substrate that includes an active surface and an inacti...