US Patent Issued to SAMSUNG ELECTRONICS on March 24 for "Semiconductor light emitting device package" (South Korean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,344, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor light emitting device package" was invented by Seolyoung Choi (Yongin-si, South Korea), Sun Kim (Hwaseong-si, South Korea), Kyoungjun Kim (Yongin-si, South Korea) and Junghun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor light emitting device package includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; me...