ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,464, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).
"Module tray for semiconductor device" was invented by Taegeon Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module tray for a semiconductor device includes a case body defining at least one cavity therein to accommodate a semiconductor substrate on a bottom surface of the cavity. The case body defining first and second inner walls of the at least one cavity extending parallel to each other in a first horizontal direction and having first and second end portions, third and fourth inner walls of the at least one cavity exte...