US Patent Issued to SAMSUNG ELECTRONICS on March 24 for "Layer structures including dielectric layer, methods of manufacturing dielectric layer, electronic device including dielectric layer, and electronic apparatus including electronic device" (South Korean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,438, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Layer structures including dielectric layer, methods of manufacturing dielectric layer, electronic device including dielectric layer, and electronic apparatus including electronic device" was invented by Woochul Lee (Gunpo-si, South Korea), Yongsung Kim (Suwon-si, South Korea), Jiwoon Park (Suwon-si, South Korea), Jooho Lee (Hwaseong-si, South Korea) and Yong-Hee Cho (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a layer structure including a dielectric layer, a method of manufacturing the dielectric layer, an e...