US Patent Issued to SAMSUNG ELECTRONICS on March 24 for "Integrated circuit devices including stacked elements and methods of forming the same" (New York Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,489, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Integrated circuit devices including stacked elements and methods of forming the same" was invented by Byounghak Hong (Albany, N.Y.), Jeonghyuk Yim (Halfmoon, N.Y.), Inchan Hwang (Schenectady, N.Y.), Gilhwan Son (Clifton Park, N.Y.), Seungyoung Lee (Clifton Park, N.Y.), Saehan Park (Clifton Park, N.Y.), Janggeun Lee (Delmar, N.Y.), Myunghoon Jung (Clifton Park, N.Y.), Seungchan Yun (Waterford, N.Y.), Buhyun Ham (Mechanicville, N.Y.) and Kang-Ill Seo (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit devices may include a transistor, a ...