US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Wafer defect prediction device and operating method thereof" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,579,343, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Wafer defect prediction device and operating method thereof" was invented by Bumsuk Chung (Hwaseong-si, South Korea) and Hakgyun Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of predicting wafer defect information includes estimating a distribution with respect to defect occurrence time data, the defect occurrence time data including information about a time associated with a wafer defect occurrence, distinguishing a defect distribution type according to a result of the estimating the distribution, and outputting wafe...