US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Substrate rotating apparatus, substrate processing system including the same, and substrate processing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,647, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate rotating apparatus, substrate processing system including the same, and substrate processing method using the same" was invented by Sangjine Park (Suwon-si, South Korea), Seungmin Shin (Suwon-si, South Korea), Jihoon Jeong (Seongnam-si, South Korea), Young-Hoo Kim (Yongin-si, South Korea) and Kuntack Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate rotating apparatus may include a spin chuck supporting a substrate and a stage rotating the spin chuck about an axis parallel to a first direction. The spin chuck...