US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Semiconductor package including pads" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,009, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including pads" was invented by Hyunsoo Chung (Suwon-si, South Korea) and Younglyong Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first substrate, a plurality of first pads on the first substrate, and a plurality of through-electrodes extending through the first substrate and connected to the plurality of first pads, and a second semiconductor chip on the first semiconductor chip, the second semiconductor chip including a second subs...