US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,931, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Juhyeon Kim (Suwon-si, South Korea), Ilhwan Kim (Suwon-si, South Korea), Sunkyoung Seo (Suwon-si, South Korea) and Chajea Jo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a first semiconductor chip including first pads; a second semiconductor chip below the first semiconductor chip, the second semiconductor chip including a substrate including a front surface and an opposing rear surface, second pads on the front surface a...