US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Semiconductor package and method of manufacturing same" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,664, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing same" was invented by Haseob Seong (Suwon-si, South Korea) and Aenee Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes; a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes; a first substrate, a first bonding pad on a first surface of the first substrate, and a first passivation layer on the first surface of the first substrate exposing at least a portion of the fi...