US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Integrated circuit device and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,932, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Integrated circuit device and semiconductor package including the same" was invented by Bongwee Yu (Suwon-si, South Korea) and Junho Huh (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device including a first semiconductor chip, a plurality of signal through silicon vias (TSV), a second semiconductor chip, a plurality of signal bumps and an interposer may be provided. The signal TSVs may be in the first semiconductor chip by a first pitch. The second semiconductor chip may be on the first semiconductor chip...