US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Fingerprint sensor package and smart card including the same" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,579,398, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Fingerprint sensor package and smart card including the same" was invented by Gwangjin Lee (Bucheon-si, South Korea), Jaehyun Lim (Hwaseong-si, South Korea) and Hyunjong Moon (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a fingerprint sensor package including a first substrate including first bonding pads and an external connection pad, a second substrate attached to the first substrate, the second substrate including a plurality of first sensing patterns spaced apart from each other in a first direction and extending ...