US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Substrate processing apparatus including edge ring assembly and substrate processing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,651,730, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus including edge ring assembly and substrate processing method using the same" was invented by Sungsoo Choi (Suwon-si, South Korea) and Wonyoung Jee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a lower plate in a chamber, an electrostatic chuck on the lower plate, the electrostatic chuck including a first step surface, an intermediate ring disposed on the first step surface of the electrostatic chuck, a lower ring surrounding a portion of the intermediate ring and an...