US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor package including heat dissipation structure" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,043, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including heat dissipation structure" was invented by Juil Choi (Suwon-si, South Korea), Jusuk Kang (Suwon-si, South Korea), Hyungjun Park (Suwon-si, South Korea), Sanghyuck Oh (Suwon-si, South Korea), Hyunju Lee (Suwon-si, South Korea) and Sangyeol Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor package having a structure maximizing heat dissipation efficiency and a method of manufacturing the same. The semiconductor package includes a first redistribution substrate, a first semic...