US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor package having metal line spaced part from capacitor on second side of package substrate" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,044, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package having metal line spaced part from capacitor on second side of package substrate" was invented by Kwang-Chul Choi (Suwon-si, South Korea), Sang Hyun Lee (Suwon-si, South Korea), Un-Byoung Kang (Suwon-si, South Korea) and Jung Hoon Kang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate having a first side and an opposite second side, a semiconductor chip on the first side of the package substrate, a capacitor on the second side of the package substrate, a plurality ...