US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,071, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Hyoungjoo Lee (Suwon-si, South Korea), Sang-Sick Park (Suwon-si, South Korea), Chungsun Lee (Suwon-si, South Korea) and Seungyoon Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes providing a first structure, forming a connection pad on the first structure, forming a preliminary connection member on the connection pad, forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member, removing a po...