US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor devices having landing pad structures" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,789, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor devices having landing pad structures" was invented by Jinseo Choi (Suwon-si, South Korea), Sohyang Lee (Suwon-si, South Korea), Jeongmin Jin (Suwon-si, South Korea) and Sohee Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate having an active region; a gate structure in the substrate, crossing the active region, and extending in a first horizontal direction; bit line structures crossing the gate structure and extending in a second horizontal direction, intersecting the first h...