US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor device and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,072, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor device and method of manufacturing the same" was invented by Hyuekjae Lee (Suwon-si, South Korea), Minki Kim (Suwon-si, South Korea) and Seungduk Baek (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first chip and a second chip stacked on the first chip. The first chip includes a first substrate, a first upper pad on an upper surface of the first substrate, a first upper insulating layer surrounding a lower portion of the first upper pad and a sacrificial layer surrounding an upper portion...