US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,817, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and method of fabricating the same" was invented by Junggil Yang (Suwon-si, South Korea), Taehyun Kim (Suwon-si, South Korea) and Taewon Ha (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a semiconductor device and a method of fabricating the same. The semiconductor device includes a substrate including a first region and a second region; an active region on the first region and a peripheral active region on the second region; a channel pattern on the active region; a peripheral channel pattern on the ...