US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,278, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor device and method of fabricating the same" was invented by Dongmin Choi (Suwon-si, South Korea), Hyo-Sub Kim (Suwon-si, South Korea), Sangkyu Sun (Suwon-si, South Korea), Junhyeok Ahn (Suwon-si, South Korea) and Jay-Bok Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device may include a substrate including a cell block region and a peripheral region, which are adjacent to each other in a first direction, an active pattern on the cell block region, a bit line provided on the active pattern and ext...