US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Printed circuit board, semiconductor package, and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,567, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Printed circuit board, semiconductor package, and method of fabricating the same" was invented by Beoungjun Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a substrate body, first, second, and third upper conductive patterns side by side in a first direction on a top surface of the substrate body, and a photosensitive dielectric layer that at least partially covers the top surface of the substrate body. A first trench is in the substrate body between the first and second upper conductive patterns....