US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Method of fabricating semiconductor package and semiconductor package structure including the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,579, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of fabricating semiconductor package and semiconductor package structure including the semiconductor package" was invented by Junghyun Roh (Suwon-si, South Korea), Wangsun Lim (Suwon-si, South Korea), Manhee Han (Suwon-si, South Korea) and Jaeyoung Hong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of fabricating a semiconductor package, the method including forming a passivation layer and a first protective layer covering a semiconductor substrate and conductive pad above a first surface of the semicondu...