ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,726, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Adhesive composition and method of manufacturing a semiconductor device using the same" was invented by Hyungjun Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive composition comprising a binder resin and a photoinitiator. The binder resin includes a linear or a partially crosslinked copolymer having a plurality of repeating units derived from different acrylate monomers. The copolymer includes a repeating unit having a photoreactive functional group at a side chain and a repeating unit having a siloxane-based functional...