US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Wafer-to-wafer bonding structure and image sensor including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,742, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Wafer-to-wafer bonding structure and image sensor including the same" was invented by Sanghoon Kim (Suwon-si, South Korea) and Seongho Oh (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The inventive concept provides an image sensor including a step having a slope shape and an image sensor including the wafer-to-wafer bonding structure. The image sensor includes a first substrate including a pixel array, a first multilayer wiring, a first insulation layer formed on a first junction surface to pass through the first insulation layer an...