US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,026, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Daeho Lee (Hwaseong-si, South Korea), Jinhyun Kim (Yongin-si, South Korea) and Wansoo Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution substrate, a first semiconductor chip disposed on the first redistribution substrate, a first mold layer that covers the first semiconductor chip and the first redistribution substrate, a second redistribution substrate disposed on the first mold layer, a second semiconductor chip disposed on the second redi...