ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,989, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package" was invented by Young Lyong Kim (Anyang-si, South Korea) and Hyunsoo Chung (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip on a package substrate, a second semiconductor chip on the first semiconductor chip and having a redistribution layer on a bottom surface thereof, under-bump pads on a bottom surface of the redistribution layer, first solders adjacent to the first semiconductor chip and connecting first pads of the under-bump pads to substrate...