US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,970, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Yongkoon Lee (Suwon-si, South Korea), Myungsam Kang (Hwaseong-si, South Korea) and Youngchan Ko (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a vertical structure on the substrate on one side of the semiconductor chip, a molding layer on the substrate and surrounding the semiconductor chip and the vertical structure, and a conductive pattern on the molding layer. The vertical structure includes a fi...