US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Semiconductor chip and semiconductor package with planar surfaces recess structure and lower dielectric isolation" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,930, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor chip and semiconductor package with planar surfaces recess structure and lower dielectric isolation" was invented by Aenee Jang (Seoul, South Korea), Yoonsung Kim (Seoul, South Korea), Seungduk Baek (Hwaseong-si, South Korea) and Yunrae Cho (Guri-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes, a base structure including a body, an upper pad on the body, and an upper insulating layer on a side surface of the upper pad, the base structure having a planar upp...