US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Polishing apparatus for a substrate and polishing method for a substrate using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,757, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Polishing apparatus for a substrate and polishing method for a substrate using the same" was invented by Donghoon Kwon (Suwon-si, South Korea) and Boun Yoon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing apparatus for a substrate, includes: a polishing pad having at least one region formed of a light-transmitting material; a platen on which the polishing pad is disposed on an upper surface thereof, having a groove portion in a region overlapping the polishing pad, and rotatably installed in one direction; a light source u...