US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Methods of manufacturing semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,592, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Methods of manufacturing semiconductor devices" was invented by Hoju Song (Suwon-si, South Korea), Eunjung Kim (Suwon-si, South Korea), Kihyung Nam (Suwon-si, South Korea), Jaehyung Park (Suwon-si, South Korea) and Yunjae Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device may include forming word lines in word line trenches on a substrate, removing a portion of the substrate located between a pair of the word lines to form a direct contact hole, forming on an inner wall of the direct c...