US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Fingerprint sensor package and fingerprint authentication card including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,664,815, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Fingerprint sensor package and fingerprint authentication card including the same" was invented by Yechung Chung (Suwon-si, South Korea), Yoon-Seok Seo (Suwon-si, South Korea), Jaehyun Lim (Suwon-si, South Korea) and Inho Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fingerprint sensor package includes: a substrate including an insulating layer and a wiring layer; a fingerprint sensor chip on the substrate; a molding material to mold the fingerprint sensor chip on the substrate and including a first region and a second region...