US Patent Issued to SAMSUNG ELECTRONICS on June 2 for "Semiconductor package including buffer chip bonded to memory dies using wires" (South Korean Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,487, issued on June 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including buffer chip bonded to memory dies using wires" was invented by Manho Lee (Suwon-si, South Korea), Jungmin Seo (Suwon-si, South Korea), Kwangseob Shin (Suwon-si, South Korea), Woosin Choi (Suwon-si, South Korea) and Junghwan Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A buffer chip is wire-bonded to memory dies. A semiconductor package includes a semiconductor die stack, a first set of wire bonds connected to a first set of semiconductor dies, a second set of wire bonds connected to a second set o...