US Patent Issued to SAMSUNG ELECTRONICS on June 2 for "Chemical mechanical polishing apparatus and method of controlling the same" (South Korean Inventor)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,193, issued on June 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Chemical mechanical polishing apparatus and method of controlling the same" was invented by Wonkeun Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a chemical mechanical polishing apparatus and a method of controlling the same, and the chemical mechanical polishing apparatus includes: a polishing pad having a hollow shape and including a plurality of first grooves disposed at an edge of the polishing pad and arranged in a circumferential direction; a substrate support positioned below the polishing ...