US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Wire structure, wire capacitor, and electronic device including the wire capacitor" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,658,341, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Wire structure, wire capacitor, and electronic device including the wire capacitor" was invented by Jaehoon Kim (Suwon-si, South Korea) and Hyun-Ji Song (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wire structure includes a metal layer, a dielectric layer covering at least a portion of an outer surface of the metal layer, and a filling material provided in the dielectric layer, wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer."

The patent was filed on Dec. 13, 2023, under Applica...