US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Substrate processing apparatus and substrate alignment method using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,315, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus and substrate alignment method using the same" was invented by Daejung Kim (Seoul, South Korea), Minyoung Kang (Seoul, South Korea), Sungsoo Kim (Yongin-si, South Korea), Sohee Kim (Sejong-si, South Korea) and Yongsoo Yoo (Daegu, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes performing a substrate processing process by carrying a substrate into a chamber, and disposing the substrate in a loading region of the chamber, capturing an image of a lower surface of the substrate to acquire a first imag...