US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package with semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,677, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package with semiconductor devices" was invented by Yeongkwon Ko (Suwon-si, South Korea), Unbyoung Kang (Suwon-si, South Korea), Soyeon Kwon (Suwon-si, South Korea) and Chungsun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a first semiconductor device including a first semiconductor substrate, a first interconnect structure on the first semiconductor substrate, and a trench extending into the first interconnect structure and a portion of the first semiconductor substra...