US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package including connection of dummy pad and test pad" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,714, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including connection of dummy pad and test pad" was invented by Youngjun Yoon (Suwon-si, South Korea), Yunseok Choi (Suwon-si, South Korea) and Jongpa Hong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including first front connection pads on a first front surface, first rear connection pads and dummy pads on a first rear surface, and through-electrodes. The package includes a second semiconductor chip including second front connection pads and test pa...